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PYCON, INC PRINTED CIRCUIT BOARDS

Pycon, Inc. is a state-of-the-art supplier of advanced multi-layered printed circuit boards. 
Pycon, Inc. excels in low volume, high mix printed circuit boards.
  Standard Advanced Limited Run
Materials

 

 

 

FR-4 SERIES, 170Tg (FR406)(FR410) Yes Yes Yes
45N Yes Yes Yes
370HR Yes Yes Yes
Getek Yes Yes Yes
Rogers / Rogers Hybrids Yes Yes Yes
Nelco-13 Yes Yes Yes
Polymide, 260Tg 31n;33n;85n;p95 Yes Yes Yes
       
Inner Layers      
Min. Core Dielectric >= .004 .003 .002
Min. Line 1/2 oz. copper >= .00375 .0035 .003
Min. Space 1/2 oz. copper >= .00375 .0035 .003
Min. Line 1 oz. copper .004 .00375 .0035
Min. Space 1 oz. copper .0045 .004 .00375
Min. Line 2oz. copper .005 .0045 .004
Min. Space 2oz. copper .006 .0055 .00475
Min. Pad size over drill (overall) .012 .010 .008
Min. Plane Clearance diameter over drilled hole (overall) .020 .016 .012
       
Outer Layers      
Min. Line 1 oz. copper .004 .00375 .0035
Min. Space 1 oz. copper .0045 .00425 .004
       
Multi-Layer Construction      
Max. Layers 16 38 >50
Max. Thickness <= .125 .125-.250 >= .300
Min. Thickness Tolerance +/- 10% +/- 7% +/- 5%
Blind & Buried Vias Yes Yes Yes
Controlled Dielectrics Thickness +/- .003 +/- .002 +/- .001
Layer to Layer Registration +/- .005 +/- .003 +/- .003
Bow & Twist (inch per inch) > .007 > .005 > .003
       
Drilling      
Min. Drill Size .010 .008 .006
Controlled Depth Drilling +/- .008 +/- .005 +/- .003
Drill Position .002 .0015 .001
       
Electrolytic Plating      
Max. Aspect Ratio, Copper (thru-hole) 9:1 15:1 30:1
Plasma Etch-back Yes Yes Yes
Electrolytic Hard Gold, tips, selective Yes Yes Yes
Electrolytic Soft Gold Yes Yes Yes
Conductive Silver &
Non-Conductive Via Fill
Yes Yes Yes
Edge Plating Yes Yes Yes
       
Solder Mask & Legend      
Solder Mask Type (LPISM) Taiyo PSR-400 Taiyo PSR-400 Taiyo PSR-400
Colors (Green, blue, red, clear, black) Green Any Any
Min. Solder Mask Dams .004 .0035 .003
Min. Solder Mask Clearance .004 .003 .003
Legend Colors (White, yellow, black, red) White Any Any
Via Fill Yes Yes Yes
Via Tent (Dry Film) Yes Yes Yes
       
Surface Finishes      
Solder Leveling Yes Yes Yes
OSP Yes Yes Yes
Entek Yes Yes Yes
       
Fabrication      
Fabricated dimensions (routing) +/- .005 +/- .004 +/- .004
Fabrication radius +/- 5° +/- 5° +/- 5°
Fabricated dimensions (scoring, X & Y axis) +/- .010 +/- .005 +/- .005
Fabricated dimensions (scoring, Z axis) +/- .005 +/- .004 +/- .004
Beveling Yes Yes Yes
Edge Milling Yes Yes Yes
Counter-sink/bore Yes Yes Yes
       
Testing      
Double Sided Grid (.070/.080) Yes Yes Yes
Flying Probe Yes Yes Yes
Single edged
Differential
Broad-side coupled
Edge coupled
Yes Yes Yes
Impedance Tolerance +/- 10% +/- 8% +/- 5%


 

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